|
|
Trade Leads: |
| [SELL] Bisallyl Bisphenol A [2008-06-27] |
Molecular formula C21H24O2
Molecular weight : 308.42
Specification :
Appearance : Colorless or yellowish liquid
Main content : 96%min
hydroxyl content : 10.5%min
allyl content : 26.5%min
Application:
1.It is principally used in the modifier of Bismaleimide(BMI). It can reduce the applying cost of BMI resin greatly, improve its operation and techics,and improve its tenacity, heat-resistance and model forming. BMI can be used in one, electric insulated, high temperature resistant varnish of circuit board with copper coated, layered board, model plastic etc. two,friction-resistant material, diamond grinding wheel, heavy-burdened grinding wheel, brake slice, high temperature resistant adhesive of axletree etc. three, transverse spaceflight configurable material. four, functional material.
2.As an age-resistance of rubber, it can improve its age-resistance greatly with 1-3% BBA added.
... |
|
 |
| [SELL] Bisallyl Bisphenol A [2008-06-28] |
Molecular formula
C21H24O2
Molecular weight : 308.42
Specification :
Appearance : Colorless or
yellowish liquid
Main content : 96%min
hydroxyl content : 10.5%
min
allyl content : 26.5%min
Application:
1.It is principally used in
the modifier of Bismaleimide(BMI).
It can reduce the applying cost of
BMI resin greatly, improve its
operation and techics,and improve
its tenacity, heat-resistance and
model forming. BMI can be used in
one, electric insulated, high
temperature resistant varnish of
circuit board with copper coated,
layered board, model plastic etc.
two,friction-resistant material,
diamond grinding wheel, heavy-
burdened grinding wheel, brake
slice, high temperature resistant
adhesive of axletree etc. three,
transverse spaceflight
configurable material. four,
functional material.
2.As an age-resistance of
rubber, it can improve its age-
resistance greatly with 1-3% BBA
added.
... |
|
>> Total2,1pages,showing1--2 1
<< |
|